Increasing reliability of Power semiconductor devices - IGBT

Fiber optic sensor for direct and accurate temperature monitoring of power modules

Miniature fiber optic sensor designed for direct temperature monitoring of power semiconductor devices. Applicable for measurement of junction temperature of a GaN-based HEMT and establishment of temperature mission profile on Power Electronics module.

Key features

  • Immune to EMI and RFI
  • Compatible with high voltage environment
  • Non-invasive (very low thermal mass)
  • Fast response time (~ms)
  • Small size (~150 μm)
  • High temperature range (up to 350°C)
  • Simple and easy to use
  • Highly flexible construction: can be deployed in complicated and small areas


  • Junction temperature evaluation
  • Thermal stress analysis
  • Thermal management and control
  • Power point tracking algorithms and thermal modelling assessment
  • Active temperature monitoring during service
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